Ceramic Substrate, Ceramic PCB, Ceramic Metallization, AlN, Al2O3, Direct Plating Copper, DPC, DBC, Ceramic– Advanced ceramic substrates – Electronics Manufacturing
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Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)?Kothers & produce final circuit coating:0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation
Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)?Kothers & produce final circuit coating:0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate
The integration of the thin film,thick film,electrode plating and electroless plating processes
Application:
1. High Power LED ceramic substrate
2. Microwave (Wireless Communication & Radar)
3. Semiconductor Process Equipment
4. Solar Cell
5. Hybrid Electric Vehicles
6.Flip chip/eutectic substrate
7.Sensor ceramic substrate
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Product Guide:
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