LED Chip, Ceramic Substrate, Ceramic Metallization, Ceramic DPC, Ceramic DBC, Thin Film Ceramic Substrate
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Ceramic Metallized Substrates (DPC/DBC): Thin/thick film substrates on Al?O? or AlN ceramic, metallized with Au, Ag, Cu, or Ni; circuit coating thickness from 0.1 μm to 5 mils for power electronics and sensors.
Thin & Thick Film DPC /DBC Substrate OEM/ODM Ceramic metallized: gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)…others & produce final circuit coating:0.1um to 5mil Ceramic Metallized substrate Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate The integration of the thin film,thick film,electrode plating and electroless plating processes Application: 1. High Power LED ceramic substrate 2. Microwave (Wireless Communication & Radar) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6.Flip chip/eutectic substrate 7.Sensor ceramic substrate
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