Aluminum Silicon Carbide, AlSiC High Thermal Conductivity for Electronic Packaging Materials – Advanced Semiconductor Materials Supplier & OEM Cost

Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional Metal Matrix Composites, AlSiC offers superior structural stability and optimized material properties.It cleverly combines the excellent thermal conductivity and lightweight of aluminum with the low thermal expansion coefficient, high rigidity, and high hardness of silicon carbide. The main processes include powder metallurgy, infiltration method, etc.

Aluminum Silicon Carbide Electronic Substrate Specification

Advantages

-Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan.

-The low-density characteristic gives it an irreplaceable advantage in weight sensitive applications.

-The high specific rigidity is several times that of steel, and its excellent structural support and vibration resistance ensure the stability of components in harsh environments.

-High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress.

Product Features

-Adjustable coefficient of thermal expansion (CTE)

-Excellent thermal conductivity and heat dissipation performance

-Low density and high specific rigidity

-High rigidity and high strength Excellent thermal shock resistance

-Excellent wear resistance

-Surface Machinability and Metalization

Application Fields

-Semiconductor packaging

-Automotive industry

-EADS

-Optical system Precision Instrument